Tomohiro Moriya

Inventor

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Work History

Patent OwnerApplications FiledYear
Seiko Epson Corporation and King Jim Co., Ltd.
1
1997
SEIKO EPSON CORPORATION
2
2
1997
1999
TOHOKU UNIVERSITY
2
2017
KING JIM CO., LTD.
1
1997
FUJI ELECTRIC CO., LTD.
2
3
2
5
2014
2015
2016
2017

Inventor Addresses

AddressDuration
Matsumoto, JPJan 01, 19 - Aug 20, 24
Matsumoto-city, JPOct 06, 22 - Oct 10, 24
Matsumoto-shi, JPSep 21, 17 - Jun 27, 19
Sendai, JPMar 28, 17 - Aug 20, 19
Sendai-city, JPJan 01, 15 - Aug 04, 16
Sendai-shi, JPSep 15, 16 - Jul 20, 17
TOKYO, JPJun 07, 01 - Jun 07, 01
Tokyo, JPJul 18, 00 - Aug 28, 01

Technology Profile

Technology Matters
B26D: CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 1
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 1
B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS 3

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0339,5022024SILICON CARBIDE SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME1
2024/0304,6732024SILICON CARBIDE SEMICONDUCTOR DEVICE0
120683662024Semiconductor device0
2024/0213,3072024SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE0
2024/0096,9902024SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE0

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