Pezhman Monadgemi
Inventor
Stats
- 34 US patents issued
- 44 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 34 US Patents Issued
- 44 US Applications Filed
- 994 Total Citation Count
- Aug 7, 2023 Most Recent Filing
- Mar 9, 2007 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION | 2
6 | 2007
2011 |
| WESTERN DIGITAL (FREMONT), LLC | 1
2 2 2 | 2010
2011 2013 2015 |
| LUMENTUM OPERATIONS LLC | 2
| 2013
|
| PACIFIC BIOSCIENCES OF CALIFORNIA, INC. | 2
4 2 1 | 2009
2011 2012 2014 |
| SILICON LABORATORIES INC. | 2
| 2007
|
| GEORGIA TECH RESEARCH CORPORATION | 2
| 2009
|
| INVENSAS CORPORATION | 14
6 4 8 1 | 2012
2013 2014 2015 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Fremont, CA, US | Sep 29, 09 - Feb 18, 20 |
| Mountain View, CA, US | Oct 14, 14 - Nov 04, 14 |
| Santa Clara, CA, US | Jan 15, 15 - Jan 07, 25 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 2 |
| B01L: | CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE | 2 |
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12191284 | 2025 | Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the same | 0 |
| 2024/0312,919 | 2024 | INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS | 0 |
| 2023/0378,137 | 2023 | THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTERPOSERS CARRYING A SUBSET OF THE EXTERNAL CONTACTS OF THE ASSEMBLY, AND METHODS OF MAKING THE SAME | 0 |
| 11742328 | 2023 | Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the same | 0 |
| 2022/0208,728 | 2022 | THERMALLY EFFICIENT SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING INTERPOSERS CARRYING A SUBSET OF THE EXTERNAL CONTACTS OF THE ASSEMBLY, AND METHODS OF MAKING THE SAME | 4 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.