Fumihiko Momose
Inventor
Stats
- 4 US patents issued
- 20 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 20 US Applications Filed
- 60 Total Citation Count
- Oct 22, 2024 Most Recent Filing
- Sep 10, 2010 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| FUJI ELECTRIC CO., LTD. | 2
2 5 2 3 | 2010
2013 2015 2016 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Higashi-chikuma-gun, JP | Oct 22, 15 - Feb 06, 25 |
| Higashi-chikuma-gun, Nagano, JP | Dec 10, 20 - Dec 10, 20 |
| Higashichikuma Gun, JP | Aug 04, 11 - Oct 14, 14 |
| Kawasaki, JP | Dec 18, 18 - Dec 18, 18 |
| Kawasaki-shi, JP | Feb 04, 16 - Feb 04, 16 |
| Nagano, JP | Mar 12, 13 - Sep 05, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 7 |
| C21D: | MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING, OR OTHER TREATMENTS | 1 |
| C22C: | ALLOYS | 5 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0041,977 | 2025 | SOLDER MATERIAL | 0 |
| 2023/0387,062 | 2023 | SEMICONDUCTOR DEVICE | 0 |
| 2023/0307,346 | 2023 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 0 |
| 11749581 | 2023 | Semiconductor module and method for manufacturing same | 0 |
| 2022/0375,845 | 2022 | SEMICONDUCTOR DEVICE | 0 |
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