Tetsuharu Mizutani

Inventor

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Work History

Patent OwnerApplications FiledYear
Maruya Seisakusho Co., Ltd.
2
2
1
2003
2004
2006
NEC INFRONTIA CORPORATION
2
2
2
2003
2004
2006
Soldercoat Co., Ltd.
2
2
2
2003
2004
2006
Soldercoast Co., Ltd.
1
2003
Maruya Seisakusbo Co., Ltd.
1
2006
NEC Toppan Circuit Solutions Toyama, Inc.
1
2
1
2003
2004
2006
NEC Toppan Circuit Solutions Toyoma, Inc.
2
1
2003
2006
NIHON DEN-NETSU KEIKI CO., LTD.
2
2
2
2003
2004
2006

Inventor Addresses

AddressDuration
Aichi, JPMar 31, 05 - Feb 17, 09
Kasugai, JPJun 07, 05 - Jun 07, 05
Kasugai-shi, JPSep 11, 03 - Sep 11, 03

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 2
H01K: ELECTRIC INCANDESCENT LAMPS 1
H01L: SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
74904032009Soldering method1
2007/0107,2142007Soldering method1
71763882007Soldering method and solder joint member1
69021022005Soldering method and solder joint member4
2005/0067,1892005Soldering method and solder joint member1

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