Tetsuharu Mizutani
Inventor
Stats
- 3 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 3 US Applications Filed
- 39 Total Citation Count
- Dec 5, 2006 Most Recent Filing
- Jan 10, 2003 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
Maruya Seisakusho Co., Ltd. | 2
2 1 | 2003
2004 2006 |
NEC INFRONTIA CORPORATION | 2
2 2 | 2003
2004 2006 |
Soldercoat Co., Ltd. | 2
2 2 | 2003
2004 2006 |
Soldercoast Co., Ltd. | 1
| 2003
|
Maruya Seisakusbo Co., Ltd. | 1
| 2006
|
NEC Toppan Circuit Solutions Toyama, Inc. | 1
2 1 | 2003
2004 2006 |
NEC Toppan Circuit Solutions Toyoma, Inc. | 2
1 | 2003
2006 |
NIHON DEN-NETSU KEIKI CO., LTD. | 2
2 2 | 2003
2004 2006 |
Inventor Addresses
Address | Duration |
---|---|
Aichi, JP | Mar 31, 05 - Feb 17, 09 |
Kasugai, JP | Jun 07, 05 - Jun 07, 05 |
Kasugai-shi, JP | Sep 11, 03 - Sep 11, 03 |
Technology Profile
Technology | Matters | |
---|---|---|
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
H01K: | ELECTRIC INCANDESCENT LAMPS | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
7490403 | 2009 | Soldering method | 1 |
2007/0107,214 | 2007 | Soldering method | 1 |
7176388 | 2007 | Soldering method and solder joint member | 1 |
6902102 | 2005 | Soldering method and solder joint member | 4 |
2005/0067,189 | 2005 | Soldering method and solder joint member | 1 |
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