Yasuyuki Mizuno
Inventor
Stats
- 14 US patents issued
- 26 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 14 US Patents Issued
- 26 US Applications Filed
- 310 Total Citation Count
- Nov 7, 2019 Most Recent Filing
- Aug 24, 1993 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| HITACHI CHEMICAL COMPANY, LTD. | 1
1 1 3 3 3 2 1 3 3 2 | 1998
2000 2001 2002 2003 2007 2008 2010 2011 2012 2015 |
| PURECIRCLE SDN BHD | 2
| 2007
|
| RIKEN TECHNOS CORPORATION | 1
1 | 1993
1995 |
Inventor Addresses
| Address | Duration |
|---|---|
| Chikusei, JP | Oct 02, 12 - Apr 02, 19 |
| Chikusei-shi, JP | Aug 23, 12 - Apr 05, 18 |
| Chiyoda-ku, Tokyo, JP | Feb 23, 17 - Jul 25, 19 |
| Ibaraki, JP | Jul 10, 03 - Mar 26, 13 |
| Shimodate, JP | Dec 05, 00 - Jul 18, 06 |
| Shimodate-shi, JP | Oct 10, 02 - Oct 10, 02 |
| Tokyo, JP | May 09, 95 - Mar 12, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A05K: | 1 | |
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 16 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11930594 | 2024 | Adhesive film for multilayer printed-wiring board | 0 |
| 11432400 | 2022 | Interlayer insulating film and method for producing same | 1 |
| 11359055 | 2022 | Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board | 0 |
| 11041045 | 2021 | Resin composition, prepreg, laminate and multilayer printed wiring board | 0 |
| 2020/0071,464 | 2020 | THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | 1 |
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