Keita Mizuma

Inventor

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Work History

Patent OwnerApplications FiledYear
TOWA CORPORATION
1
2012

Inventor Addresses

AddressDuration
Kyoto, JPMar 03, 22 - Jun 04, 24
Kyoto-shi, JPJan 15, 15 - Apr 11, 24
Kyoto-shi, Kyoto, JPJun 29, 23 - Jun 29, 23

Technology Profile

Technology Matters
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 4
B65H: HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
119990832024Resin molding apparatus and method for producing resin molded product0
2024/0116,2192024METHOD FOR PRODUCING RESIN MOLDED PRODUCT0
2023/0398,6382023LASER PROCESSING DEVICE AND PROCESSED ARTICLE MANUFACTURING METHOD0
2023/0202,0792023RESIN MOLDING APPARATUS, COVER PLATE, AND RESIN MOLDED ARTICLE PRODUCTION METHOD0
2022/0063,1502022RESIN MOLDING APPARATUS AND METHOD FOR PRODUCING RESIN MOLDED PRODUCT0

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