YOUNG-GI MIN
Inventor
Stats
- 1 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 3 US Applications Filed
- 10 Total Citation Count
- Jul 27, 2018 Most Recent Filing
- Jun 18, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 1
1 | 2015
2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| ASAN-SI, KR | May 30, 19 - May 30, 19 |
| Asan-si, KR | Apr 21, 16 - Nov 05, 19 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G01R: | MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES | 3 |
| G11C: | STATIC STORES | 1 |
| H01B: | CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10470315 | 2019 | Manufacturing method of test socket and test method for semiconductor package | 0 |
| 2019/0164,851 | 2019 | TEST INTERFACE BOARD AND SYSTEM INCLUDING THE SAME | 4 |
| 9983229 | 2018 | Test socket for testing semiconductor chip package and method of manufacturing the same | 1 |
| 2017/0118,846 | 2017 | MANUFACTURING METHOD OF TEST SOCKET AND TEST METHOD FOR SEMICONDUCTOR PACKAGE | 1 |
| 2016/0109,480 | 2016 | TEST SOCKET FOR TESTING SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2 |
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