Gab Yong Min
Inventor
Stats
- 1 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 3 US Applications Filed
- 29 Total Citation Count
- Jan 30, 2008 Most Recent Filing
- Apr 22, 2005 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| STATS CHIPPAC LTD. | 1
| 2008
|
| STATS CHIPPAC PTE. LTE. | 1
2 | 2005
2008 |
Inventor Addresses
| Address | Duration |
|---|---|
| Ichon-Si, KR | Jul 17, 12 - Jul 17, 12 |
| Ichon-si, KR | Jul 30, 09 - Jul 30, 09 |
| Singapore, SG | Oct 26, 06 - Oct 26, 06 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8221583 | 2012 | System for peeling semiconductor chips from tape | 10 |
| 2009/0191,029 | 2009 | SYSTEM FOR HANDLING SEMICONDUCTOR DIES | 5 |
| 2008/0173,407 | 2008 | SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE | 3 |
| 2006/0237,142 | 2006 | SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE | 7 |
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