Yann Mignot
Inventor
Stats
- 12 US patents issued
- 128 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 12 US Patents Issued
- 128 US Applications Filed
- 322 Total Citation Count
- Jun 29, 2023 Most Recent Filing
- Sep 18, 2013 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
LAM RESEARCH CORPORATION | 1
| 2013
|
STMICROELECTRONICS, INC. | 5
7 7 3 1 | 2013
2014 2015 2016 2017 |
INTERNATIONAL BUSINESS MACHINES CORPORATION | 4
7 5 3 | 2013
2014 2015 2016 |
GLOBALFOUNDRIES INC. | 4
| 2015
|
TOKYO ELECTRON LIMITED | 1
1 3 | 2013
2015 2016 |
Inventor Addresses
Address | Duration |
---|---|
Albany, NY, US | Jan 01, 15 - Jan 01, 15 |
Singerlands, NY, US | Apr 30, 20 - May 09, 24 |
Slingerlands, NY, US | Mar 19, 15 - Mar 04, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
B01L: | CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE | 2 |
B81B: | MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES | 1 |
B81C: | PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12243770 | 2025 | Hard mask removal without damaging top epitaxial layer | 0 |
12237175 | 2025 | Polymerization protective liner for reactive ion etch in patterning | 0 |
12207477 | 2025 | Same level MRAM stacks having different configurations | 0 |
12191388 | 2025 | Area scaling for VTFET contacts | 0 |
2025/0006,658 | 2025 | Three Dimensional Crackstop Interweave Architectural Design Using Supervia. | 0 |
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