Jeremy McCutcheon
Inventor
Stats
- 7 US patents issued
- 11 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 11 US Applications Filed
- 227 Total Citation Count
- Nov 21, 2014 Most Recent Filing
- Jul 8, 2004 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| BREWER SCIENCE INC. | 1
2 2 3 3 6 | 2004
2009 2010 2011 2012 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Rolla, MO | May 10, 07 - May 10, 07 |
| Rolla, MO, US | Sep 03, 09 - Oct 16, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| B08B: | CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL | 1 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10103048 | 2018 | Dual-layer bonding material process for temporary bonding of microelectronic substrates to carrier substrates | 1 |
| 9827757 | 2017 | Methods of transferring device wafers or layers between carrier substrates and other surfaces | 0 |
| 9472436 | 2016 | Multiple bonding layers for thin-wafer handling | 0 |
| 9263314 | 2016 | Multiple bonding layers for thin-wafer handling | 3 |
| 9224631 | 2015 | Multiple bonding layers for thin-wafer handling | 1 |
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