Hideaki Matsunaga
Inventor
Stats
- 6 US patents issued
- 12 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 6 US Patents Issued
- 12 US Applications Filed
- 60 Total Citation Count
- Nov 26, 2024 Most Recent Filing
- Jan 2, 1980 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SANOH INDUSTRIAL CO., LTD. | 1
| 2005
|
| Takara Belmont Corporation | 2
2 | 2002
2004 |
| TOSOH ORGANIC CHEMICAL CO., LTD. | 2
| 2013
|
| SANYO ELECTRIC CO., LTD. | 1
2 2 | 1997
2002 2004 |
| CKD Kabushiki Kaisha | 1
| 1987
|
| Toyo Soda Manufacturing Co., Ltd. | 1
| 1980
|
| SANYO ELECTRIC TECHNO CLEAN CO., LTD. | 2
2 | 2002
2004 |
Inventor Addresses
| Address | Duration |
|---|---|
| Aichi, JP | Sep 27, 88 - Sep 27, 88 |
| Beppu City, JP | May 04, 23 - May 04, 23 |
| Beppu, JP | Feb 20, 20 - Mar 13, 25 |
| Beppu-Shi Oita-Ken, JP | Mar 06, 25 - Mar 06, 25 |
| Ibaraki, JP | Feb 07, 08 - Feb 07, 08 |
| Kusatsu, JP | May 25, 99 - May 25, 99 |
| Moriguchi, JP | Oct 03, 06 - Mar 20, 07 |
| Moriguchi-shi Osaka, JP | Dec 23, 04 - Dec 30, 04 |
| Oita, JP | Dec 29, 20 - Dec 29, 20 |
| Shin-nanyo, JP | Jul 07, 81 - Jul 07, 81 |
| Yamaguchi, JP | Sep 03, 15 - Nov 29, 16 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A45D: | HAIRDRESSING OR SHAVING EQUIPMENT; MANICURING OR OTHER COSMETIC TREATMENT | 3 |
| C07C: | ACYCLIC OR CARBOCYCLIC COMPOUNDS | 1 |
| C07F: | ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM, OR TELLURIUM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0087,591 | 2025 | FRAME DESIGN IN EMBEDDED DIE PACKAGE | 0 |
| 2025/0079,247 | 2025 | MOLD COMPOUND TRENCHES TO FACILITATE PACKAGE SINGULATION | 0 |
| 12154861 | 2024 | Frame design in embedded die package | 0 |
| 11942384 | 2024 | Semiconductor package having an interdigitated mold arrangement | 0 |
| 2023/0137,762 | 2023 | SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT | 0 |
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