Harumi Matsuda
Inventor
Stats
- 0 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 6 US Applications Filed
- 29 Total Citation Count
- May 16, 2022 Most Recent Filing
- Oct 13, 2011 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| MITSUBISHI CHEMICAL CORPORATION | 1
1 | 2011
2012 |
| ASAHI KASEI E-MATERIALS CORPORATION | 1
| 2012
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hiroshima, JP | Nov 07, 13 - Jul 10, 18 |
| Tokyo, JP | Jul 10, 14 - Nov 07, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| C08F: | MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 1 |
| C08G: | MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11809079 | 2023 | Photosensitive resin composition, polyimide production method, and semiconductor device | 0 |
| 2022/0269,170 | 2022 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 0 |
| 2020/0301,273 | 2020 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 0 |
| 10719016 | 2020 | Photosensitive resin composition, polyimide production method, and semiconductor device | 1 |
| 2019/0072,850 | 2019 | PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE | 1 |
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