Takahisa Mase
Inventor
Stats
- 0 US patents issued
- 4 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 4 US Applications Filed
- 387 Total Citation Count
- Sep 1, 2021 Most Recent Filing
- Oct 27, 2006 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TOKYO ELECTRON LIMITED | 1
| 2006
|
Inventor Addresses
| Address | Duration |
|---|---|
| Nirasaki City, JP | Jan 21, 21 - Mar 10, 22 |
| Nirasaki, JP | Nov 01, 22 - Mar 18, 25 |
| Nirasaki-Shi, JP | Jun 14, 07 - Jun 14, 07 |
| Yamanashi, JP | Aug 12, 21 - Oct 03, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 2 |
| F27B: | FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS | 1 |
| G01K: | MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12256471 | 2025 | Apparatus for heating substrate and method thereof | 0 |
| 11774298 | 2023 | Multi-point thermocouples and assemblies for ceramic heating structures | 0 |
| 11488847 | 2022 | Apparatus and method for heat-treating substrate | 0 |
| 2022/0078,888 | 2022 | APPARATUS FOR HEATING SUBSTRATE AND METHOD THEREOF | 1 |
| 2021/0247,240 | 2021 | MULTI-POINT THERMOCOUPLES AND ASSEMBLIES FOR CERAMIC HEATING STRUCTURES | 1 |
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