Kensaku Motoki
Inventor
Stats
- 61 US patents issued
- 80 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 61 US Patents Issued
- 80 US Applications Filed
- 1968 Total Citation Count
- Jul 29, 2015 Most Recent Filing
- Aug 29, 1996 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SONY CORPORATION | 2
3 1 1 2 1 | 2003
2004 2005 2006 2009 2010 |
| SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. | 2
| 2014
|
| SUMITOMO ELECTRIC INDUSTRIES, LTD. | 1
2 2 4 3 2 9 6 16 7 12 2 13 11 14 5 1 1 6 | 1996
1997 1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 |
| SHARP KABUSHIKI KAISHA | 3
9 2 4 2 3 1 | 2002
2004 2006 2008 2009 2010 2012 |
| KOHA CO., LTD. | 6
| 2010
|
Inventor Addresses
| Address | Duration |
|---|---|
| Hyogo, JP | Nov 10, 98 - Jun 12, 12 |
| ITAMI, JP | Jan 31, 02 - Jan 31, 02 |
| ITAMI-SHI, JP | May 30, 02 - May 30, 02 |
| Itami, JP | Oct 19, 99 - Apr 05, 16 |
| Itami-shi, JP | Apr 15, 04 - Sep 19, 13 |
| Koka, JP | Apr 11, 17 - Apr 11, 17 |
| Koka-shi, JP | Jun 23, 16 - Jun 23, 16 |
| Mino, JP | Feb 05, 08 - Dec 28, 10 |
| Mino-Shi, JP | Sep 14, 06 - Sep 14, 06 |
| Mino-shi, JP | Sep 24, 09 - Sep 24, 09 |
| Minoo, JP | Nov 02, 04 - Dec 18, 12 |
| Minoo-Shi, JP | Jul 17, 03 - Feb 24, 05 |
| Minoo-shi, JP | Mar 03, 05 - Nov 04, 10 |
| Osaka, JP | Aug 26, 04 - Aug 06, 13 |
| Osaka-shi, JP | May 09, 13 - Dec 24, 15 |
| Shiga, JP | Jul 26, 18 - Jul 26, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 2 |
| B82Y: | SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; MEASUREMENT OR ANALYSIS OF NANO-STRUCTURES; MANUFACTURE OR TREATMENT OF NANO-STRUCTURES | 1 |
| C01B: | NON-METALLIC ELEMENTS; COMPOUNDS THEREOF | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2018/0212,129 | 2018 | HEAT DISSIPATION CIRCUIT BOARD AND METHOD FOR PRODUCING HEAT DISSIPATION CIRCUIT BOARD | 7 |
| 9618190 | 2017 | LED module including flexible printed circuit board with adhesive layers and LED lighting fixture | 3 |
| 2016/0178,166 | 2016 | LED MODULE AND LED LIGHTING FIXTURE | 2 |
| 9305776 | 2016 | Oxygen-doped gallium nitride crystal substrate | 0 |
| 2015/0369,467 | 2015 | HEAT DISSIPATION CIRCUIT BOARD AND METHOD FOR PRODUCING SAME | 16 |
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