Takahiko Mitsui
Inventor
Stats
- 12 US patents issued
- 31 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 12 US Patents Issued
- 31 US Applications Filed
- 110 Total Citation Count
- Jul 29, 2022 Most Recent Filing
- Jan 21, 2000 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
NIKON CORPORATION | 1
1 | 2003
2004 |
NISSAN MOTOR CO., LTD. | 2
| 2007
|
YAZAKI CORPORATION | 1
1 2 2 2 1 4 2 1 2 6 | 2000
2004 2006 2007 2008 2010 2011 2012 2014 2015 2017 |
Inventor Addresses
Address | Duration |
---|---|
Annaka, JP | Sep 05, 23 - Sep 05, 23 |
Annaka-shi, JP | Sep 11, 03 - Jun 25, 20 |
Fukuoka-ken, JP | Feb 10, 05 - Feb 10, 05 |
Gunma, JP | Nov 01, 18 - Aug 20, 24 |
Haibara-gun, JP | Jul 06, 06 - Jul 06, 06 |
Kakegawa, JP | Aug 07, 12 - Aug 13, 13 |
Kakegawa-shi, JP | Sep 29, 11 - Apr 04, 13 |
Makinohara, JP | Mar 30, 10 - Aug 29, 23 |
Makinohara-shi, JP | Aug 09, 07 - Dec 30, 21 |
Shizuoka, JP | Jul 25, 17 - Jul 14, 20 |
Shizuoka-ken, JP | Jul 17, 01 - Jul 17, 01 |
Technology Profile
Technology | Matters | |
---|---|---|
B24B: | MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING | 9 |
B24D: | TOOLS FOR GRINDING, BUFFING, OR SHARPENING | 1 |
B60R: | VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR | 4 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12068165 | 2024 | Method for manufacturing semiconductor device and apparatus for manufacturing semiconductor device | 0 |
11980997 | 2024 | Dressing apparatus and polishing apparatus | 0 |
11745299 | 2023 | Grinding method of composite substrate including resin and grinding apparatus thereof | 0 |
11742170 | 2023 | Fuse puller accommodating structure and an electrical junction box | 0 |
11735411 | 2023 | Method and apparatus for manufacturing semiconductor device | 0 |
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