Tzu-Tsen Liu
Inventor
Stats
- 0 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 5 US Applications Filed
- 21 Total Citation Count
- Oct 28, 2020 Most Recent Filing
- Jan 2, 2018 Earliest Filing
Work History
No Work History Available.Inventor Addresses
Address | Duration |
---|---|
Kaohsiung City, TW | Jul 12, 18 - Feb 11, 21 |
Kaohsiung, TW | Oct 01, 19 - Nov 22, 22 |
Technology Profile
Technology | Matters | |
---|---|---|
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 5 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11508614 | 2022 | Method of forming semiconductor device having capped air gaps between buried bit lines and buried gate | 1 |
2021/0043,684 | 2021 | METHOD OF FORMING SEMICONDUCTOR DEVICE | 0 |
10854676 | 2020 | Semiconductor device having capped air caps between buried bit lines and buried gate | 3 |
10546861 | 2020 | Semiconductor device for avoiding short circuit between adjacent storage nodes and manufacturing method thereof | 1 |
10475794 | 2019 | Semiconductor device and method for fabricating the same | 10 |
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