Junwei Liu
Inventor
Stats
- 12 US patents issued
- 43 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 12 US Patents Issued
- 43 US Applications Filed
- 100 Total Citation Count
- Sep 9, 2024 Most Recent Filing
- Jul 20, 2015 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
LEMOBILE INFORMATION TECHNOLOGY (BEIJING) CO., LTD. | 4
| 2016
|
THE HONG KONG POLYTECHNIC UNIVERSITY | 1
| 2016
|
LE HOLDINGS (BEIJING) CO., LTD. | 4
| 2016
|
SAMSUNG ELECTRONICS CO., LTD. | 1
| 2015
|
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED | 2
| 2015
|
Inventor Addresses
Address | Duration |
---|---|
Beijing, CN | Jun 15, 17 - Nov 02, 23 |
Cambridge, MA, US | Oct 19, 17 - May 01, 18 |
Guangdong, CN | Aug 10, 21 - Feb 18, 25 |
Guangzhou, CN | Aug 17, 17 - Feb 16, 21 |
Hangzhou City, Zhejiang Province, CN | Nov 25, 21 - Sep 01, 22 |
Hangzhou, CN | May 31, 22 - Oct 03, 23 |
Hong Kong, CN | Oct 15, 20 - Feb 18, 25 |
Kowloon, HK | Jan 04, 18 - Jan 04, 18 |
Kunshan, CN | Jun 22, 23 - Jun 22, 23 |
Langfang, CN | Aug 25, 22 - Aug 25, 22 |
Millbrae, CA, US | Mar 03, 22 - Dec 26, 24 |
Qingdao, CN | Nov 25, 21 - Aug 22, 23 |
Shenzhen, CN | Nov 26, 15 - Nov 10, 20 |
Tianjin, CN | Nov 03, 16 - Nov 03, 16 |
Xi'an, CN | Apr 07, 22 - Nov 12, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
B28C: | PREPARING CLAY; PRODUCING MIXTURES CONTAINING CLAY OR CEMENTITIOUS MATERIAL, e.g. PLASTER | 1 |
E02D: | FOUNDATIONS; EXCAVATIONS; EMBANKMENTS | 2 |
E04G: | SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR OTHER BUILDING AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12229662 | 2025 | All optical neural network | 0 |
D1062711 | 2025 | Case for mobile phone | 0 |
D1062712 | 2025 | Case for mobile phone | 0 |
2024/0427,122 | 2024 | Folded Optics with Tilt Actuator and Spring Suspension | 0 |
12142643 | 2024 | Material structure for low thermal resistance silicon-based gallium nitride microwave and millimeter-wave devices and manufacturing method thereof | 0 |
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