Wei-Hung Lin
Inventor
Stats
- 78 US patents issued
- 175 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 78 US Patents Issued
- 175 US Applications Filed
- 1573 Total Citation Count
- Jul 18, 2024 Most Recent Filing
- Aug 9, 2006 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 4
18 13 19 31 2 14 3 | 2010
2011 2012 2013 2014 2015 2016 2017 |
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LLC | 1
| 2011
|
| PHOENIX PRECISION TECHNOLOGY CORPORATION | 2
| 2008
|
| PHISON ELECTRONICS CORP. | 4
2 2 2 2 10 8 3 | 2008
2009 2010 2011 2012 2013 2014 2015 |
| SPEED TECH CORP. | 1
| 2006
|
| UNIMICRON TECHNOLOGY CORP. | 2
| 2008
|
Inventor Addresses
| Address | Duration |
|---|---|
| Gueishan Township, Taoyuan County, TW | Apr 01, 08 - Apr 01, 08 |
| HSINCHU COUNTY, TW | Aug 20, 15 - Nov 07, 24 |
| Hsin-Chu, TW | Sep 04, 08 - Apr 03, 18 |
| Hsinchu County, TW | Apr 15, 10 - Feb 25, 25 |
| Hsinchu, TW | Jul 13, 10 - Jul 07, 20 |
| Jhubei, TW | Feb 21, 12 - Feb 21, 12 |
| Miaoli County, TW | May 14, 09 - Mar 02, 10 |
| NEW TAIPEI CITY, TW | Sep 22, 16 - Sep 22, 16 |
| New Taipei City, TW | Mar 09, 17 - Jul 01, 21 |
| New Taipei, TW | Oct 03, 17 - Oct 11, 22 |
| Taipei, TW | Mar 16, 23 - Nov 19, 24 |
| Taoyuan City, TW | May 04, 23 - Jul 04, 24 |
| Taoyuan, TW | Nov 21, 23 - Dec 24, 24 |
| Xinfeng Township, Hsinchu County, TW | Jan 02, 18 - Jul 30, 24 |
| Xinfeng Township, TW | Jan 26, 12 - Feb 06, 25 |
| Xinfeng, TW | Aug 19, 14 - Aug 19, 14 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A63B: | APPARATUS FOR PHYSICAL TRAINING, GYMNASTICS, SWIMMING, CLIMBING, OR FENCING; BALL GAMES; TRAINING EQUIPMENT | 5 |
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 17 |
| B23P: | OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12237320 | 2025 | Package structure and method of forming the same | 0 |
| 2025/0046,734 | 2025 | PACKAGE CONNECTORS IN SEMICONDCUTOR PACKAGES AND METHODS OF FORMING | 0 |
| 12174758 | 2024 | Computer system having multiple nodes with flexible configurable architecture | 0 |
| 12146646 | 2024 | Light-emitting sphere | 0 |
| 2024/0371,816 | 2024 | RADIANT SUBSTRATE HEATING FOR THERMOCOMPRESSIVE BONDING AND APPARATUS FOR IMPLEMENTING THE SAME | 0 |
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