JHENG-WEI LIN
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 0 Total Citation Count
- Nov 17, 2023 Most Recent Filing
- Jun 7, 2022 Earliest Filing
Work History
No Work History Available.Inventor Addresses
Address | Duration |
---|---|
Hsinchu City, TW | Jun 08, 23 - Jan 16, 25 |
Hsinchu, TW | Mar 11, 25 - Mar 11, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12249539 | 2025 | Multigate device structure with engineered cladding and method making the same | 0 |
2025/0022,956 | 2025 | STRESS LINERS IN SEMICONDUCTOR DEVICES | 0 |
2023/0178,418 | 2023 | MULTIGATE DEVICE STRUCTURE WITH ENGINEERED CLADDING AND METHOD MAKING THE SAME | 0 |
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