Geng Lin

Inventor

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Work History

Patent OwnerApplications FiledYear
DOW GLOBAL TECHNOLOGIES INC.
1
1
2006
2011
DELL PRODUCTS L.P.
15
3
2013
2015
SIKA TECHNOLOGY AG
1
2017
THE BANK OF NEW YORK MELLON, AS COLLATERAL AGENT
1
2015
CRODA INTERNATIONAL PLC
1
2
2010
2012
PPG INDUSTRIES OHIO, INC.
2
2006
INNOLUX CORPORATION
2
2005
DOW GLOBAL TECHNOLOGIES LLC
1
2005

Inventor Addresses

AddressDuration
Cupertino, CA, USDec 05, 13 - Oct 16, 18
Rochester Hills, MIAug 24, 06 - Nov 30, 06
Rochester Hills, MI, USJul 17, 08 - Oct 03, 24
San Jose, CA, USAug 14, 14 - Apr 14, 15
Savannah, GA, USMay 19, 11 - May 19, 11
Shanghai, CNJan 31, 19 - Sep 12, 24
Sinshih Township, TWOct 13, 05 - Oct 13, 05
Sinshih Township, Tainan County, TWDec 30, 08 - Dec 30, 08

Technology Profile

Technology Matters
A01N: PRESERVATION OF BODIES OF HUMANS OR ANIMALS OR PLANTS OR PARTS THEREOF 1
A01P: BIOCIDAL, PEST REPELLANT, PEST ATTRACTANT OR PLANT GROWTH REGULATORY ACTIVITY OF CHEMICAL COMPOUNDS OR PREPARATIONS 1
A61K: PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0327,6872024EXPANDABLE ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION0
2024/0300,8552024Chemically Strengthened Glass Ceramic, Preparation Method Thereof, and Electronic Device1
117810482023One-component thermosetting epoxy adhesive with improved adhesion0
113775322022Approach to heat expandable materials0
2022/0064,5052022ONE-COMPONENT THERMOSETTING EPOXY ADHESIVE WITH IMPROVED ADHESION0

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