Chun-Neng LIN
Inventor
Stats
- 0 US patents issued
- 51 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 51 US Applications Filed
- 31 Total Citation Count
- Jul 17, 2024 Most Recent Filing
- Jun 22, 2018 Earliest Filing
Work History
No Work History Available.Inventor Addresses
Address | Duration |
---|---|
HSIN-CHU, TW | Feb 17, 22 - Jun 22, 23 |
HSINCHU COUNTY, TW | Nov 25, 21 - Nov 10, 22 |
Hsin-Chu, TW | Feb 21, 23 - Feb 21, 23 |
Hsin-chu, TW | Dec 28, 23 - Dec 28, 23 |
Hsinchu City, TW | Apr 14, 22 - Oct 24, 24 |
Hsinchu County, TW | Dec 26, 19 - Dec 31, 24 |
Hsinchu, TW | Feb 04, 21 - Feb 25, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
B08B: | CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL | 2 |
C09K: | MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR | 2 |
G03F: | PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12237400 | 2025 | Method of forming semiconductor device | 0 |
12183823 | 2024 | Fin field-effect transistor with a gate structure having a dielectric protection layer | 0 |
2024/0371,962 | 2024 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 0 |
2024/0371,688 | 2024 | SEMICONDUCTOR DEVICE WITH DOPED REGION DIELECTRIC LAYER | 0 |
12136566 | 2024 | Semiconductor device and method of manufacture | 0 |
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