Shoa Siong Lim
Inventor
Stats
- 4 US patents issued
- 7 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 7 US Applications Filed
- 76 Total Citation Count
- Jul 11, 2018 Most Recent Filing
- Oct 4, 2007 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ORION SYSTEMS INTEGRATION PTE LTD | 2
| 2009
|
| ADVANPACK SOLUTIONS PTE LTD. | 1
| 2013
|
| AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH | 1
| 2007
|
| ADVANPACK SOLUTIONS PTE LTD. | 6
| 2009
|
Inventor Addresses
| Address | Duration |
|---|---|
| Singapore, SG | Apr 09, 09 - Oct 15, 19 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 2 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 7 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 10446457 | 2019 | Multi-layer substrate for semiconductor packaging | 0 |
| 2018/0323,121 | 2018 | Multi-Layer Substrate For Semiconductor Packaging | 0 |
| 10049950 | 2018 | Multi-layer substrate for semiconductor packaging | 0 |
| 9847268 | 2017 | Semiconductor package and manufacturing method thereof | 0 |
| 9136215 | 2015 | Manufacturing method for semiconductor package | 1 |
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