Jerry Liang
Inventor
Stats
- 0 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 3 US Applications Filed
- 35 Total Citation Count
- Apr 6, 2006 Most Recent Filing
- Apr 6, 2006 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD | 3
| 2006
|
| Jiangsu Changiang Electronics Technology Co., Ltd. | 1
| 2006
|
Inventor Addresses
| Address | Duration |
|---|---|
| Xinzhu County, TW | - |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 2 |
| H01R: | ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS | 1 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2008/0315,412 | 2008 | Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same | 7 |
| 2008/0285,251 | 2008 | Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same | 4 |
| 2008/0258,273 | 2008 | Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same | 22 |
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