Wen Cheng Li
Inventor
Stats
- 0 US patents issued
- 1 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 1 US Applications Filed
- 8 Total Citation Count
- Jul 14, 2011 Most Recent Filing
- Jul 14, 2011 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD. | 1
| 2011
|
SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD. | 1
| 2011
|
Inventor Addresses
Address | Duration |
---|---|
Taichung City, TW | Jan 17, 13 - Jan 17, 13 |
Technology Profile
Technology | Matters | |
---|---|---|
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2013/0015,589 | 2013 | CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS | 6 |
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