Pai-Yuan Li
Inventor
Stats
- 0 US patents issued
- 8 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 8 US Applications Filed
- 32 Total Citation Count
- Nov 6, 2024 Most Recent Filing
- Feb 19, 2014 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO., LTD. | 1
| 2014
|
Inventor Addresses
| Address | Duration |
|---|---|
| TAICHUNG, TW | Sep 13, 18 - Feb 20, 25 |
| Taichun, TW | Jul 02, 19 - Jul 02, 19 |
| Taichung, TW | Jun 25, 15 - Dec 10, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 8 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0062,250 | 2025 | SEMICONDUCTOR DEVICE | 0 |
| 12165990 | 2024 | Semiconductor device | 0 |
| 2023/0178,498 | 2023 | SEMICONDUCTOR DEVICE | 0 |
| 11587886 | 2023 | Semiconductor device | 0 |
| 10872871 | 2020 | Chip package structure with dummy bump and method for forming the same | 0 |
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