Jeng-Ting LI
Inventor
Stats
- 0 US patents issued
- 6 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 6 US Applications Filed
- 1 Total Citation Count
- May 15, 2023 Most Recent Filing
- Apr 12, 2021 Earliest Filing
Work History
No Work History Available.Inventor Addresses
Address | Duration |
---|---|
Pingtung County, TW | Mar 03, 22 - Dec 31, 24 |
Taoyuan City, TW | Oct 24, 24 - Oct 24, 24 |
Taoyuan, TW | Mar 11, 25 - Mar 11, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
C03C: | CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS | 1 |
H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 4 |
H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
12250776 | 2025 | Substrate structure and cutting method thereof | 0 |
12185479 | 2024 | Flexible circuit board and manufacturing method thereof | 0 |
2024/0357,748 | 2024 | SUBSTRATE STRUCTURE AND CUTTING METHOD THEREOF | 0 |
12062742 | 2024 | Package structure and manufacturing method of the same | 0 |
2023/0402,391 | 2023 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 0 |
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