Huan Wun Li
Inventor
Stats
- 3 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 3 US Applications Filed
- 300 Total Citation Count
- Oct 25, 2016 Most Recent Filing
- Jul 22, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 1
1 | 2015
2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Kaohsiung, TW | Oct 04, 16 - Apr 26, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 3 |
| H02J: | CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2018/0114,758 | 2018 | SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME | 3 |
| 9953931 | 2018 | Semiconductor device package and a method of manufacturing the same | 5 |
| 9922938 | 2018 | Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same | 0 |
| 2017/0025,363 | 2017 | SEMICONDUCTOR DEVICE PACKAGE INTEGRATED WITH COIL FOR WIRELESS CHARGING AND ELECTROMAGNETIC INTERFERENCE SHIELDING, AND METHOD OF MANUFACTURING THE SAME | 7 |
| 9461001 | 2016 | Semiconductor device package integrated with coil for wireless charging and electromagnetic interference shielding, and method of manufacturing the same | 282 |
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