Chen-Yu Li
Inventor
Stats
- 14 US patents issued
- 20 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 14 US Patents Issued
- 20 US Applications Filed
- 117 Total Citation Count
- Oct 31, 2022 Most Recent Filing
- Oct 25, 2004 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SPI ELECTRONIC CO., LTD. | 1
1 | 2004
2005 |
| PLASTICS INDUSTRY DEVELOPMENT CENTER | 1
| 2016
|
| FSP TECHNOLOGY INC. | 1
| 2006
|
| NATIONAL CHIAO TUNG UNIVERSITY | 1
| 2016
|
| WISTRON CORPORATION | 2
3 2 4 2 2 3 | 2007
2009 2010 2011 2014 2015 2016 |
Inventor Addresses
| Address | Duration |
|---|---|
| Miaoli County, TW | Apr 25, 19 - May 19, 20 |
| New Taipei City, TW | Jul 26, 12 - Mar 01, 18 |
| New Taipei, TW | Jun 10, 14 - Dec 04, 18 |
| Taichung City, TW | Mar 14, 24 - Mar 14, 24 |
| Taichung, TW | Feb 27, 18 - Feb 27, 18 |
| Taipei Hsien, TW | Jul 14, 09 - Jun 25, 13 |
| Taoyuan City, TW | Jun 23, 05 - Jun 23, 05 |
| Taoyuan Hsien, TW | Oct 30, 07 - Oct 30, 07 |
| Taoyuan, TW | Jan 30, 07 - Jan 30, 07 |
| Zhuqi Township, TW | Dec 15, 16 - Jun 25, 19 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A44B: | BUTTONS, PINS, BUCKLES, SLIDE FASTENERS, OR THE LIKE | 1 |
| B60Q: | ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL | 1 |
| C07F: | ACYCLIC, CARBOCYCLIC, OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM, OR TELLURIUM | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0084,072 | 2024 | METHOD OF SYNTHESIZING POLYLACTIC ACID AND CATALYST THEREOF | 0 |
| 10660212 | 2020 | Element submount and method for manufacturing the same | 0 |
| 10332974 | 2019 | Method of making a semiconductor device | 0 |
| 2019/0124,774 | 2019 | ELEMENT SUBMOUNT AND METHOD FOR MANUFACTURING THE SAME | 1 |
| RE47151 | 2018 | Assembly of an electronic device casing, a heat-dissipating module and a waterproofing module, waterproofing module, and electronic device | 0 |
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