Sang-Jae Lee
Inventor
Stats
- 8 US patents issued
- 37 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 8 US Patents Issued
- 37 US Applications Filed
- 411 Total Citation Count
- Sep 20, 2023 Most Recent Filing
- Nov 8, 1996 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE | 1
4 2 1 | 2003
2006 2010 2015 |
| MEDISON CO., LTD. | 1
| 1999
|
| SAMSUNG ELECTRO-MECHANICS CO., LTD. | 2
| 2016
|
| AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION | 1
| 2015
|
| SAMSUNG ELECTRONICS CO., LTD. | 2
1 2 | 1996
2004 2006 |
| STC Nara Co., Ltd. | 1
| 2002
|
| I-CIUS CO., LTD. | 1
| 2012
|
Inventor Addresses
| Address | Duration |
|---|---|
| Daejeon, KR | Jun 23, 11 - Aug 15, 23 |
| Daejon, KR | Feb 15, 07 - Feb 16, 10 |
| Gimpo-si, KR | Oct 30, 07 - Oct 30, 07 |
| Hwaseong-si, Gyeonggi-do, KR | Nov 03, 22 - Nov 03, 22 |
| Hwaseong-si, KR | Aug 29, 23 - Aug 29, 23 |
| Iksan-City, KR | Jun 03, 04 - Jun 03, 04 |
| North Augusta, SC, US | Nov 26, 20 - Nov 26, 20 |
| San Diego, CA, US | Nov 02, 23 - Mar 20, 25 |
| Seoul, KR | Sep 22, 98 - Dec 19, 19 |
| Sungnam, KR | Aug 01, 06 - May 25, 10 |
| Sungnam-City, KR | Nov 02, 06 - Nov 02, 06 |
| Suwon-si, KR | May 24, 07 - Mar 16, 21 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| A61B: | DIAGNOSIS; SURGERY; IDENTIFICATION | 1 |
| A61K: | PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOSES | 1 |
| C07K: | PEPTIDES | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0098,066 | 2025 | PACKAGE COMPRISING A SUBSTRATE WITH AN INTERCONNECT BLOCK | 0 |
| 2025/0096,051 | 2025 | PACKAGE COMPRISING A SUBSTRATE WITH CAVITY, AND AN INTEGRATED DEVICE LOCATED IN THE CAVITY OF THE SUBSTRATE | 0 |
| 2025/0079,281 | 2025 | PACKAGE SUBSTRATE EMPLOYING FILM SUBSTRATE AND AN OUTER PRE-IMPREGNATED (PPG) SUBSTRATE(S) TO SUPPORT HIGH DENSITY BUMP AND WIRE BOND CONNECTIONS, AND RELATED HYBRID INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | 0 |
| 2025/0062,235 | 2025 | PACKAGE SUBSTRATE WITH METALLIZATION LAYER(S) THAT INCLUDES AN ADDITIONAL METAL PAD LAYER TO FACILITATE REDUCED VIA SIZE FOR REDUCED BUMP PITCH, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS | 0 |
| 2025/0062,246 | 2025 | STRUCTURE FOR DELAMINATION MITIGATION IN A SEMICONDUCTOR DEVICE | 0 |
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