Heesoo Lee
Inventor
Stats
- 25 US patents issued
- 150 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 25 US Patents Issued
- 150 US Applications Filed
- 859 Total Citation Count
- Oct 4, 2024 Most Recent Filing
- Nov 21, 2003 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE | 2
2 6 6 8 6 2 4 2 | 2003
2005 2007 2008 2009 2010 2012 2013 2015 |
| INDUSTRY ACADEMY COOPERATION FOUNDATION OF KYUNGHEE UNIVERSITY | 2
| 2007
|
| CHUNG-ANG UNIVERSITY INDUSTRY-ACADEMY COOPERATION FOUNDATION | 1
| 2010
|
| STATS CHIPPAC PTE. LTE. | 2
3 3 | 2013
2014 2015 |
| UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY | 2
| 2007
|
| INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY | 2
2 1 | 2015
2016 2017 |
Inventor Addresses
| Address | Duration |
|---|---|
| Anyang-si, KR | Mar 26, 15 - Jan 02, 18 |
| Daejeon, KR | Oct 14, 08 - Apr 10, 25 |
| Daejeon-city, KR | Sep 14, 06 - Aug 05, 10 |
| Daejon, KR | Mar 11, 10 - Mar 20, 12 |
| Gyeonggi-do, KR | Dec 16, 21 - Oct 24, 23 |
| Incheon, KR | Nov 10, 22 - Apr 10, 25 |
| Kyunggi-do, KR | Jun 07, 18 - Apr 01, 25 |
| SUWON-SI, KR | Jan 04, 24 - Jan 04, 24 |
| Seoul, KR | Dec 17, 15 - Jun 26, 18 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 3 |
| C01B: | NON-METALLIC ELEMENTS; COMPOUNDS THEREOF | 2 |
| C01C: | AMMONIA; CYANOGEN; COMPOUNDS THEREOF | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2025/0118,599 | 2025 | Semiconductor Device and Method of Forming Embedded Trace Substrate with Barrier Layer to Inhibit Electromigration | 0 |
| 2025/0119,969 | 2025 | METHOD AND APPARATUS FOR COMMUNICATION FAILURE PREDICTION AND RECOVERY | 0 |
| 12266587 | 2025 | Semiconductor device and method for advanced thermal dissipation | 0 |
| 12266614 | 2025 | Molded laser package with electromagnetic interference shield and method of making | 0 |
| 2025/0105,162 | 2025 | Semiconductor Device and Method of Forming Fine-Pitch Interconnection Using Insulating Layer | 0 |
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