Hao Lee

Inventor

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Work History

Patent OwnerApplications FiledYear
SARNOFF CORPORATION
2
1998
HUAWEI TECHNOLOGIES CO., LTD.
2
2
2
2
2004
2006
2007
2009
XPONENT (ASSIGNMENT FOR BENEFIT OF CREDITORS), LLC
2
2
4
2
2003
2004
2006
2007
HOYA CORPORATION
2
2
2003
2006
Oprices, Inc.
1
2006
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
2
2001

Inventor Addresses

AddressDuration
Arcadia, CAJan 10, 06 - Oct 18, 07
Arcadia, CA, USJul 08, 04 - Oct 19, 10
Camas, WA, USDec 19, 19 - Jul 04, 24
Hualien City, TWSep 30, 21 - Sep 30, 21
Huntington Beach, CA, USNov 25, 21 - Dec 05, 23
Lawrenceville, NJOct 17, 00 - Dec 11, 01
Los Gatos, CASep 13, 07 - Sep 13, 07
New Taipei City, TWAug 16, 18 - Oct 18, 18
Pasadena, CAJun 24, 03 - Jun 24, 03
Pasadena, CA, USJun 20, 02 - Jun 20, 02

Technology Profile

Technology Matters
B01L: CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE 1
B26B: HAND-HELD CUTTING TOOLS NOT OTHERWISE PROVIDED FOR 1
B64C: AEROPLANES; HELICOPTERS 2

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
2024/0222,1222024ADHESION LAYERS FOR EUV LITHOGRAPHY0
119729482024Adhesion layers for EUV lithography0
118350822023Folding assembly0
112860432022Nose landing gear assembly for use with an aircraft0
2021/0364,0202021FOLDING ASSEMBLY0

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