Gi Sub Lee
Inventor
Stats
- 3 US patents issued
- 5 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 5 US Applications Filed
- 13 Total Citation Count
- Dec 16, 2021 Most Recent Filing
- Aug 5, 2010 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
SAMSUNG ELECTRO-MECHANICS CO., LTD. | 2
2 1 | 2010
2012 2014 |
Inventor Addresses
Address | Duration |
---|---|
Busan, KR | Mar 24, 11 - Sep 22, 15 |
Suwon-si, KR | May 12, 22 - Jan 09, 24 |
Technology Profile
Technology | Matters | |
---|---|---|
B65B: | MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGING ARTICLES OR MATERIALS; UNPACKING | 1 |
B65D: | CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES | 1 |
H01B: | CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING, OR DIELECTRIC PROPERTIES | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
11869718 | 2024 | Multilayer capacitor and board having the same mounted thereon | 0 |
11670452 | 2023 | Multilayer electronic component | 0 |
2022/0189,690 | 2022 | MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON | 0 |
2022/0148,804 | 2022 | MULTILAYER ELECTRONIC COMPONENT | 0 |
9142499 | 2015 | Lead pin for package substrate | 0 |
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