Chih Cheng Lee
Inventor
Stats
- 4 US patents issued
- 15 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 15 US Applications Filed
- 108 Total Citation Count
- May 2, 2023 Most Recent Filing
- Sep 3, 1997 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| E. Gluck Corporation | 2
| 1997
|
| HON HAI PRECISION INDUSTRY CO., LTD. | 1
| 1997
|
| AMC Automation Co., Ltd. | 1
| 2013
|
| San Fong Machinery Enterprise Co., Ltd. | 1
| 2013
|
| ADVANCED SEMICONDUCTOR ENGINEERING, INC. | 1
| 2016
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kaohsiung, TW | Feb 06, 18 - Aug 01, 23 |
| New Taipei City, TW | Jun 06, 24 - Jun 06, 24 |
| Sinju, TW | Nov 25, 14 - Nov 25, 14 |
| Taipei, TW | Sep 01, 98 - Sep 22, 98 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G08B: | SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS | 1 |
| H01J: | ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 11 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0188,251 | 2024 | LIQUID-COOLING SYSTEM INCLUDING MONITORING AND ALERTING MODULE, MONITORING AND ALERTING METHOD FOR LIQUID-COOLING SYSTEM, AND ELECTRONIC DEVICE INCLUDING THE SAME | 0 |
| 11715694 | 2023 | Embedded component package structure having a magnetically permeable layer | 0 |
| 11276660 | 2022 | Semiconductor device package having a core substrate and an embedded component in the core substrate | 0 |
| 11232993 | 2022 | Semiconductor device package and method of manufacturing the same | 0 |
| 2021/0343,648 | 2021 | EMBEDDED COMPONENT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 0 |
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