Brian CH Lee
Inventor
Stats
- 1 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 2 US Applications Filed
- 5 Total Citation Count
- May 14, 2015 Most Recent Filing
- Nov 20, 2012 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
LENOVO INTERNATIONAL LIMITED | 1
2 | 2012
2015 |
Inventor Addresses
Address | Duration |
---|---|
Taipei, TW | May 30, 13 - Jul 19, 16 |
Technology Profile
Technology | Matters | |
---|---|---|
G06F: | ELECTRIC DIGITAL DATA PROCESSING | 1 |
H01R: | ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS | 2 |
H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
9397422 | 2016 | Circuit board assembly, electronic device having the same, and lifting and lowering apparatus thereof | 0 |
2015/0325,936 | 2015 | CIRCUIT BOARD ASSEMBLY, ELECTRONIC DEVICE HAVING THE SAME, AND LIFTING AND LOWERING APPARATUS THEREOF | 0 |
2013/0135,833 | 2013 | Circuit Board Assembly, Electronic Device Having the Same, and Lifting and Lowering Apparatus Thereof | 4 |
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