Fabrice Lallement
Inventor
Stats
- 7 US patents issued
- 10 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 10 US Applications Filed
- 56 Total Citation Count
- Apr 15, 2014 Most Recent Filing
- Feb 9, 2006 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| STMicroelectronics S.A. | 2
| 2006
|
| SOITEC | 4
2 2 2 4 1 | 2008
2009 2011 2012 2013 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Aix les Bains, FR | Jan 20, 11 - Sep 17, 13 |
| Aix-les-Bains, FR | Apr 22, 10 - Apr 07, 15 |
| Bernin, FR | Jul 25, 17 - Jul 25, 17 |
| Grenoble, FR | Aug 10, 06 - Feb 03, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 9 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9716029 | 2017 | Method for transferring a layer of a semiconductor and substrate comprising a confinement structure | 3 |
| 8999090 | 2015 | Process for bonding two substrates | 7 |
| 8946053 | 2015 | Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate | 0 |
| 2014/0225,182 | 2014 | SUBSTRATE HAVING A CHARGED ZONE IN AN INSULATING BURIED LAYER | 0 |
| 2014/0183,601 | 2014 | METHOD FOR TRANSFERRING A LAYER OF A SEMICONDUCTOR AND SUBSTRATE COMPRISING A CONFINEMENT STRUCTURE | 3 |
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