Rickie C Lake
Inventor
Stats
- 128 US patents issued
- 134 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 128 US Patents Issued
- 134 US Applications Filed
- 4258 Total Citation Count
- Sep 11, 2014 Most Recent Filing
- Jan 25, 1993 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
APTINA IMAGING CORPORATION | 2
2 5 1 | 2004
2006 2008 2011 |
AVANDEL INCORPORATED | 2
| 1999
|
INTEL CORPORATION | 1
5 1 | 2002
2003 2006 |
ROUND ROCK RESEARCH, LLC | 5
2 5 8 25 13 22 13 16 2 4 3 4 | 1993
1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2007 |
MICRON COMMUNICATIONS, INC. | 3
2 2 3 1 | 1993
1994 1995 1997 1998 |
U.S. BANK NATIONAL ASSOCIATION | 1
| 2014
|
MICRON TECHNOLOGY, INC. | 5
2 5 8 25 13 20 12 16 2 3 4 3 7 2 2 2 3 | 1993
1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 2007 2008 2011 2012 2014 |
NEOPHOTONICS CORPORATION | 4
2 2 | 2002
2003 2004 |
DOW AGROSCIENCES LLC | 1
1 | 1999
2000 |
Inventor Addresses
Address | Duration |
---|---|
Boise, ID | Jul 05, 94 - Aug 29, 00 |
EAGLE, ID, US | Jun 07, 01 - Dec 05, 02 |
Eagle, ID | Sep 05, 95 - Nov 27, 08 |
Eagle, ID, US | Apr 19, 01 - Sep 16, 14 |
Meridian, ID | Jul 27, 06 - Mar 04, 08 |
Meridian, ID, US | Feb 23, 06 - Aug 22, 17 |
Sunnyvale, CA | Aug 10, 04 - Jul 29, 08 |
Sunnyvale, CA, US | Sep 18, 03 - Apr 04, 17 |
Technology Profile
Technology | Matters | |
---|---|---|
B01F: | MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING | 1 |
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 3 |
B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
9737947 | 2017 | Microfeature workpieces having alloyed conductive structures, and associated methods | 0 |
9612409 | 2017 | Hermetic sealing of optical module | 3 |
9153491 | 2015 | Methods for forming conductive elements and vias on substrates and for forming multi-chip modules | 0 |
2015/0031,171 | 2015 | METHODS FOR FORMING CONDUCTIVE ELEMENTS AND VIAS ON SUBSTRATES AND FOR FORMING MULTI-CHIP MODULES | 0 |
2014/0284,375 | 2014 | MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND ASSOCIATED METHODS | 2 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.