Hao-Hsiung Lin
Inventor
Stats
- 4 US patents issued
- 23 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 4 US Patents Issued
- 23 US Applications Filed
- 94 Total Citation Count
- Oct 18, 2021 Most Recent Filing
- Jul 18, 1997 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 2
1 2 | 2014
2016 2017 |
| NATIONAL TAIWAN UNIVERSITY | 1
2 1 2 | 2006
2007 2016 2017 |
| NATIONAL SCIENCE COUNCIL | 1
| 1997
|
Inventor Addresses
| Address | Duration |
|---|---|
| Taipei City, TW | Aug 23, 07 - Feb 03, 22 |
| Taipei, TW | Apr 18, 00 - Aug 01, 23 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| G11C: | STATIC STORES | 3 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 22 |
| H03H: | IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11715770 | 2023 | Forming semiconductor structures with semimetal features | 0 |
| 11538938 | 2022 | Method for forming stressor, semiconductor device having stressor, and method for forming the same | 0 |
| 2022/0037,200 | 2022 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PACKAGING SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING SHALLOW TRENCH ISOLATION (STI) | 0 |
| 11177368 | 2021 | Semiconductor arrangement | 0 |
| 11164972 | 2021 | Method for forming stressor, semiconductor device having stressor, and method for forming the same | 0 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.