Young Joon Lee

Inventor

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Work History

Patent OwnerApplications FiledYear
ENV21 Co., Ltd.
1
2003
LG INDUSTRIAL SYSTEMS CO., LTD.
1
2003
PLASMION DISPLAYS, LLC
1
2001
ARIBIO CO., LTD.
1
2015
S-PRINTING SOLUTION CO., LTD.
1
1
1
2004
2005
2006
LEE, YOUNG JOON
1
2009
FMC CORPORATION
1
1
1
1999
2001
2003
CITICORP USA, INC.
1
2001
LG DISPLAY CO., LTD.
6
2
9
2012
2013
2014
RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
1
2003
AIMMED CO., LTD.
1
2009

Inventor Addresses

AddressDuration
Anyang, KRAug 28, 03 - Aug 28, 03
Cuyahoga Falls, OHApr 08, 03 - Apr 08, 03
Daegu, KRFeb 16, 17 - Feb 28, 19
Goyang-si, KRJul 03, 14 - Sep 11, 18
Gyeonggi-do, KRDec 19, 13 - May 24, 16
Paju-si, KRAug 01, 24 - Jan 07, 25
San Jose, CAAug 12, 03 - Feb 22, 05
San Jose, CA, USJan 24, 02 - Jan 24, 02
Seoul, KRMay 16, 02 - Oct 07, 21
Suwon-si, KRNov 03, 05 - Jul 18, 23

Technology Profile

Technology Matters
A23L: FOODS, FOODSTUFFS, OR NON-ALCOHOLIC BEVERAGES, NOT COVERED BY SUBCLASSES A21D OR A23B-A23J; THEIR PREPARATION OR TREATMENT, e.g. COOKING, MODIFICATION OF NUTRITIVE QUALITIES, PHYSICAL TREATMENT 1
A61B: DIAGNOSIS; SURGERY; IDENTIFICATION 2
A61F: FILTERS IMPLANTABLE INTO BLOOD VESSELS; PROSTHESES; DEVICES PROVIDING PATENCY TO, OR PREVENTING COLLAPSING OF, TUBULAR STRUCTURES OF THE BODY, E.G. STENTS; ORTHOPAEDIC, NURSING OR CONTRACEPTIVE DEVICES; FOMENTATION; TREATMENT OR PROTECTION OF EYES OR EARS; BANDAGES, DRESSINGS OR ABSORBENT PADS; FIRST-AID KITS 1

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
121898982025Touch sensing system and driving method thereof0
2024/0256,0862024TOUCH SENSING SYSTEM AND DRIVING METHOD THEREOF0
117025372023Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same0
116553632023Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same0
2021/0363,3792021EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR DEVICE ENCAPSULATING FILM, SEMICONDUCTOR DEVICE ENCAPSULATING FILM AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME0

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