Mooho Lee
Inventor
Stats
- 1 US patents issued
- 8 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 1 US Patents Issued
- 8 US Applications Filed
- 7 Total Citation Count
- Sep 27, 2022 Most Recent Filing
- Mar 12, 2015 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRONICS CO., LTD. | 6
| 2015
|
Inventor Addresses
| Address | Duration |
|---|---|
| Suwon-si, KR | Sep 17, 15 - Mar 12, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B01J: | CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS, COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS | 1 |
| C07C: | ACYCLIC OR CARBOCYCLIC COMPOUNDS | 1 |
| C07D: | HETEROCYCLIC COMPOUNDS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11926695 | 2024 | High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same | 0 |
| 2023/0104,237 | 2023 | AMINE-BASED CURING AGENTS, AND COMPOSITIONS, SEMICONDUCTOR PACKAGES, AND ELECTRONIC DEVICES INCLUDING THE SAME | 0 |
| 11421073 | 2022 | Highly thermally conductive epoxy compound, and composition, material for semiconductor package, molded product, electric and electronic device and semiconductor package including the same | 0 |
| 2021/0147,612 | 2021 | HIGH-THERMAL CONDUCTIVE EPOXY COMPOUND AND COMPOSITION, MATERIAL FOR SEMICONDUCTOR PACKAGE, MOLDED PRODUCT, ELECTRIC AND ELECTRONIC DEVICE, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 1 |
| 2021/0147,613 | 2021 | HIGHLY THERMALLY CONDUCTIVE EPOXY COMPOUND, AND COMPOSITION, MATERIAL FOR SEMICONDUCTOR PACKAGE, MOLDED PRODUCT, ELECTRIC AND ELECTRONIC DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 1 |
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level.
>
Upgrade to our Level for up to -1 portfolios!.