Kuo-Yuan Lee
Inventor
Stats
- 7 US patents issued
- 13 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 7 US Patents Issued
- 13 US Applications Filed
- 108 Total Citation Count
- Apr 10, 2012 Most Recent Filing
- Aug 15, 2001 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| ECBYTE CO., LTD. | 1
| 2012
|
| WALTON ADVANCED ENGINEERING INC. | 2
1 2 8 | 2007
2008 2009 2011 |
| Wey Yii Corp. | 2
| 2010
|
| Walsin Advanced Electronics LTD | 1
| 2001
|
Inventor Addresses
| Address | Duration |
|---|---|
| Kaohsiung, TW | Nov 26, 02 - Aug 26, 14 |
| Taichung, TW | Nov 18, 10 - Feb 14, 12 |
| Taipei City, TW | Oct 10, 13 - Oct 10, 13 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23B: | TURNING; BORING | 1 |
| B29C: | SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING | 1 |
| G09B: | EDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 8815645 | 2014 | Multi-chip stacking method to reduce voids between stacked chips | 1 |
| 2013/0266,923 | 2013 | Interactive Multimedia Instructional System and Device | 1 |
| 8361841 | 2013 | Mold array process method to encapsulate substrate cut edges | 1 |
| 2012/0270,368 | 2012 | MOLD ARRAY PROCESS METHOD TO ENCAPSULATE SUBSTRATE CUT EDGES | 4 |
| 2012/0264,257 | 2012 | MOLD ARRAY PROCESS METHOD TO PREVENT EXPOSURE OF SUBSTRATE PERIPHERIES | 6 |
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