Ki Wook Lee

Inventor

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Work History

Patent OwnerApplications FiledYear
AMKOR TECHNOLOGY, INC.
4
3
1
1
1
1
2
2
1
2002
2006
2007
2008
2009
2011
2012
2013
2016
THINKWARE CORPORATION
2
2017
LMS CO., LTD.
1
2015

Inventor Addresses

AddressDuration
Anyang-si Gyeonggi-do, KRMay 03, 18 - May 03, 18
Anyang-si, Gyeonggi-do, KRFeb 06, 20 - Feb 06, 20
Anyang-si, KRNov 17, 16 - May 04, 21
Hwaseong-si, KRSep 30, 21 - Sep 30, 21
Incheon, KRMar 13, 25 - Mar 13, 25
Irvine, CA, USOct 11, 18 - Mar 25, 25
Seongnam-si, KRSep 21, 17 - Sep 19, 24
Seoul, KRAug 08, 02 - May 02, 24

Technology Profile

Technology Matters
B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 3
B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES 1
B60W: CONJOINT CONTROL OF VEHICLE SUB-UNITS OF DIFFERENT TYPE OR DIFFERENT FUNCTION; CONTROL SYSTEMS SPECIALLY ADAPTED FOR HYBRID VEHICLES; ROAD VEHICLE DRIVE CONTROL SYSTEMS FOR PURPOSES NOT RELATED TO THE CONTROL OF A PARTICULAR SUB-UNIT 4

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
122611272025Application of conductive via or trench for intra module EMI shielding0
2025/0086,8192025METHOD AND SYSTEM FOR TRACKING MARKER IN AUGMENTED REALITY0
2024/0363,5092024MOLDED PACKAGE WITH INTERCONNECT POSTS WITH PLATED SOLDER CAPS0
2024/0321,7912024SMOOTH COPPER ON PACKAGING SUBSTRATE OUTER LAYERS0
2024/0314,9402024PACKAGING SUBSTRATES HAVING RINGLESS VIAS0

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