Haejin LEE
Inventor
Stats
- 3 US patents issued
- 24 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 24 US Applications Filed
- 174 Total Citation Count
- Sep 30, 2024 Most Recent Filing
- Jun 4, 2012 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY | 2
| 2013
|
LINE CORPORATION | 5
| 2012
|
Inventor Addresses
Address | Duration |
---|---|
Daejeon, KR | Aug 29, 13 - Nov 25, 14 |
Gyeonggi-do, KR | Mar 26, 20 - Feb 06, 24 |
Gyeonggl-do, KR | Feb 13, 20 - Feb 13, 20 |
Seongnam-si, KR | Dec 06, 12 - Jan 23, 18 |
Seoul, KR | Nov 28, 19 - Jan 17, 23 |
Suwon-si, KR | Dec 10, 20 - Mar 27, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
F28D: | HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT | 5 |
F28F: | DETAILS OF HEAT-EXCHANGE OR HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION | 1 |
G02B: | OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS | 2 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0107,035 | 2025 | WEARABLE DEVICE INCLUDING HEAT DISSIPATION STRUCTURE | 0 |
12238911 | 2025 | Electronic device including sheilding structure | 0 |
2025/0021,136 | 2025 | ELECTRONIC APPARATUS INCLUDING HEAT DISSIPATION SHEET | 0 |
2024/0304,565 | 2024 | ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL HAVING PHASE CHANGE MATERIAL | 0 |
2024/0188,218 | 2024 | CIRCUIT BOARD MODULE AND METHOD FOR MANUFACTURING SAME | 0 |
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