Chung Eun Lee
Inventor
Stats
- 9 US patents issued
- 21 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 9 US Patents Issued
- 21 US Applications Filed
- 149 Total Citation Count
- Jul 2, 2024 Most Recent Filing
- Jan 18, 2012 Earliest Filing
Work History
Patent Owner | Applications Filed | Year |
---|---|---|
SAMSUNG ELECTRO-MECHANICS CO., LTD. | 9
2 10 1 | 2012
2013 2014 2016 |
Inventor Addresses
Address | Duration |
---|---|
Gyunggi-do, KR | Sep 03, 13 - May 05, 15 |
Suwon, KR | Dec 20, 12 - Nov 21, 13 |
Suwon-Si, KR | Nov 05, 15 - Nov 14, 17 |
Suwon-si, KR | Jan 12, 17 - Mar 06, 25 |
Technology Profile
Technology | Matters | |
---|---|---|
B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 2 |
C03B: | MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL | 1 |
Patents / Publication
Patents / Publication # | Year of Publication / Issued | Title | Citations |
---|---|---|---|
2025/0079,085 | 2025 | MULTILAYER ELECTRONIC COMPONENT | 0 |
11901127 | 2024 | Dielectric composition and multilayer capacitor | 0 |
11901130 | 2024 | Multilayer electronic component | 0 |
11804331 | 2023 | Multilayer electronic component | 0 |
2023/0154,684 | 2023 | MULTILAYER ELECTRONIC COMPONENT | 0 |
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