Bor-Shiun Lee
Inventor
Stats
- 2 US patents issued
- 19 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 2 US Patents Issued
- 19 US Applications Filed
- 15 Total Citation Count
- Jun 14, 2023 Most Recent Filing
- May 16, 2002 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SNAPTRACK, INC. | 3
| 2015
|
| INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE | 1
| 2002
|
| TOUCH MICRO-SYSTEM TECHNOLOGY CORP. | 1
1 | 2011
2012 |
| ABC TAIWAN ELECTRONICS CORP. | 1
| 2007
|
Inventor Addresses
| Address | Duration |
|---|---|
| New Taipei City, TW | Dec 01, 16 - Oct 31, 24 |
| New Taipei, TW | Jul 25, 17 - Jan 07, 25 |
| Taipei, TW | Nov 11, 03 - Nov 11, 03 |
| Taoyuan, TW | Jul 04, 13 - Jul 04, 13 |
| Yang-Mei Town, TW | Apr 12, 12 - Apr 12, 12 |
| Yangmei, TW | Oct 13, 11 - Oct 13, 11 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B41J: | TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS | 1 |
| B81B: | MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES | 7 |
| B81C: | PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 12191219 | 2025 | Gas-permeable package lid of chip package structure and manufacturing method thereof | 0 |
| 2024/0363,456 | 2024 | GAS-PERMEABLE PACKAGE LID OF CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 0 |
| 2024/0230,413 | 2024 | INFRARED SENSOR AND ITS REFERENCE ELEMENT AND MANUFACTURING METHOD OF THE REFERENCE ELEMENT | 0 |
| 2024/0175,836 | 2024 | GAS DETECTOR | 0 |
| 11965852 | 2024 | Microelectromechanical sensor and sensing module thereof | 0 |
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