HYUK KI KWON
Inventor
Stats
- 0 US patents issued
- 2 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 2 US Applications Filed
- 4 Total Citation Count
- Oct 23, 2020 Most Recent Filing
- Jun 27, 2017 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| SAMSUNG ELECTRO-MECHANICS CO., LTD. | 1
| 2017
|
Inventor Addresses
| Address | Duration |
|---|---|
| Suwon-si, KR | Jan 18, 18 - Dec 13, 22 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 1 |
| H01Q: | AERIALS | 1 |
| H05K: | PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 11528800 | 2022 | Electronic device module | 0 |
| 2022/0046,782 | 2022 | ELECTRONIC DEVICE MODULE | 0 |
| 10269725 | 2019 | Semiconductor package and method of manufacturing the same | 0 |
| 2018/0019,211 | 2018 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 4 |
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