Ikuhiro Kuwano
Inventor
Stats
- 0 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 3 US Applications Filed
- 3 Total Citation Count
- Jul 26, 2024 Most Recent Filing
- May 15, 2019 Earliest Filing
Work History
No Work History Available.Inventor Addresses
| Address | Duration |
|---|---|
| Tokyo, JP | May 11, 21 - Nov 21, 24 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 3 |
| H01L: | SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR | 3 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2024/0387,177 | 2024 | BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER | 0 |
| 12080554 | 2024 | Bonding method, bonding device, and holding member | 0 |
| 2021/0225,651 | 2021 | BONDING METHOD, BONDING DEVICE, AND HOLDING MEMBER | 0 |
| 11004686 | 2021 | Bonding method, bonding device, and holding member | 1 |
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