Teppei Kurokawa

Inventor

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Work History

Patent OwnerApplications FiledYear
Toyo Kohan Co., Ltd.
2
2010
SUMITOMO ELECTRIC INDUSTRIES, LTD.
2
1
1
1
2010
2013
2014
2015
TOYO KOHAN CO., LTD.
1
2
3
2013
2014
2015

Inventor Addresses

AddressDuration
Kudamatsu, JPAug 26, 14 - Aug 27, 24
Kudamatsu-shi, JPAug 16, 12 - Mar 16, 23
Kudamatsu-shi, Yamaguchi, JPJul 07, 16 - Apr 02, 20
Yamaguchi, JPOct 22, 15 - Dec 12, 23

Technology Profile

Technology Matters
B21B: ROLLING OF METAL 4
B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 12
B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM 11

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Patents / Publication

Patents / Publication #Year of Publication / IssuedTitleCitations
120709232024Substrate for epitaxial growth and method for producing same0
118400452023Roll-bonded laminate0
2023/0082,1932023SUBSTRATE FOR EPITAXIAL GROWTH AND METHOD FOR PRODUCING SAME0
115906032023Roll-bonded body and method for producing same0
115244862022Substrate for epitaxtail, growth and method for producing same0

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