Chen-Shen Kuo
Inventor
Stats
- 3 US patents issued
- 4 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 3 US Patents Issued
- 4 US Applications Filed
- 6 Total Citation Count
- Jul 24, 2015 Most Recent Filing
- Aug 1, 2012 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| Vikiing Tech Corporation | 1
| 2014
|
| VIKING TECH CORPORATION | 1
4 2 | 2012
2014 2015 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hsinchu County, TW | Oct 22, 15 - Dec 05, 17 |
| Hukou Township, TW | Nov 28, 13 - Nov 28, 13 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B23K: | SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM | 1 |
| B24C: | ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL | 1 |
| B28B: | SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG OR MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER | 1 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 9837592 | 2017 | Ceramic substrate and semiconductor package having the same | 2 |
| 9768092 | 2017 | Carrier package and carrier with plural heat conductors | 0 |
| 9437549 | 2016 | Method for manufacturing ceramic substrate | 0 |
| 2016/0049,372 | 2016 | Ceramic substrate, package substrate, semiconductor chip package component and manufacturing method thereof | 1 |
| 2015/0305,201 | 2015 | Carrier and Package Having the Carrier | 1 |
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