Teruhisa Kumazawa
Inventor
Stats
- 0 US patents issued
- 3 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 0 US Patents Issued
- 3 US Applications Filed
- 33 Total Citation Count
- Nov 14, 2014 Most Recent Filing
- Dec 19, 2006 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| MITSUBISHI ENGINEERING-PLASTICS CORPORATION | 1
1 1 | 2006
2007 2014 |
Inventor Addresses
| Address | Duration |
|---|---|
| Hiratsuka-shi, Kanagawa-ken, JP | Nov 12, 09 - Nov 12, 09 |
| Kanagawa-ken, JP | Sep 09, 10 - Mar 19, 15 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 1 |
| C08K: | USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS | 3 |
| C08L: | COMPOSITIONS OF MACROMOLECULAR COMPOUNDS | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 2015/0080,516 | 2015 | POLYAMIDE RESIN COMPOSITION FOR PORTABLE ELECTRONIC DEVICE AND MOLDED ARTICLE FOR PORTABLE ELECTRONIC DEVICE | 3 |
| 2010/0227,122 | 2010 | Polyamide Resin Composition for Portable Electronic Device and Molded Article for Portable Electronic Device | 15 |
| 2009/0280,311 | 2009 | POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE | 8 |
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