Alan L Kovacs
Inventor
Stats
- 8 US patents issued
- 9 US Applications filed
- most recent filing
This is official USPTO record data
Details
- 8 US Patents Issued
- 9 US Applications Filed
- 220 Total Citation Count
- Nov 25, 2003 Most Recent Filing
- Jan 16, 1990 Earliest Filing
Work History
| Patent Owner | Applications Filed | Year |
|---|---|---|
| RAYTHEON COMPANY | 1
1 2 1 | 1997
2001 2002 2003 |
| HUGHES ELECTRONICS CORPORATION | 1
1 | 1996
1997 |
| YAKISAMI CAPITAL CO. L.L.C. | 1
| 1993
|
| Hughes Aircraft Company | 1
1 1 | 1990
1991 1993 |
| OL SECURITY LIMITED LIABILITY COMPANY | 1
| 1996
|
| W. R. GRACE & CO.-CONN. | 1
| 1990
|
Inventor Addresses
| Address | Duration |
|---|---|
| Long Beach, CA | Nov 12, 91 - Nov 30, 04 |
| Long Beach, CA, US | Feb 05, 04 - Feb 05, 04 |
Technology Profile
| Technology | Matters | |
|---|---|---|
| B05D: | PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL | 1 |
| B32B: | LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM | 3 |
| C23C: | COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL | 2 |
Patents / Publication
| Patents / Publication # | Year of Publication / Issued | Title | Citations |
|---|---|---|---|
| 6825817 | 2004 | Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules | 1 |
| 6822880 | 2004 | Multilayer thin film hydrogen getter and internal signal EMI shield for complex three dimensional electronic package components | 17 |
| 2004/0023,058 | 2004 | Dielectric interconnect frame incorporating EMI shield and hydrogen absorber for tile T/R modules | 3 |
| 2003/0062,610 | 2003 | Multilayer thin film hydrogen getter | 9 |
| 5770890 | 1998 | Using a thermal barrier to provide a hermetic seal surface on aluminum nitride substrate electronic packages | 2 |
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